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Asia Connect Scholarships at Victoria University of Wellington, New Zealand

Victoria University of Wellington

The scholarship is designed to enable students to fully immerse themselves in another culture, grow personally and academically, and return to Aotearoa New Zealand with insights about Asia that can positively impact their communities.

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The scholarship is designed to enable students to fully immerse themselves in another culture, grow personally and academically, and return to Aotearoa New Zealand with insights about Asia that can positively impact their communities.

Application instructions Apply through the provider application page and verify the full opportunity details before applying.

Apply on provider site

Applicants must verify all details with the provider before applying.

Host country/countriesNew Zealand
Eligible countries/nationalitiesUnspecified
Study levelUndergraduate
Field of studyArchitecture, Education, Engineering, Business And Government, Design Innovation
Funding typeFunding Available
DeadlineSep 1, 2026
Academic year/intakeNot stated
Application feeCheck provider details.

Benefits

Value: Up to $30,000. Tenure: One year.

Eligibility summary

Applicants must be enrolled in a full-time undergraduate degree at Te Herenga Waka – Victoria University of Wellington. Applicants must have secured or applied for a place in a university exchange programme in Singapore through the Wellington Global Exchange Programme. Applicants must be in their second year or above at the time they undertake the exchange. Applicants must be New Zealand Citizen or Permanent Resident. While not a requirement, enrolment in the Kitea Impact Programme may be considered an advantage. Eligibility categories listed by Victoria University of Wellington: Domestic.

Requirements

Not stated. Verify with the provider.

Documents required

Not stated. Verify with the provider.

Language/test requirements

Check provider requirements for language or test requirements.

Listing-board disclaimer

Prime Scholarship Alerts is a listing board only and does not provide application procedures or guarantee scholarship awards. Verify all requirements, deadlines, fees, and application instructions through the provider before applying.

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